Telink Semiconductor Co., a leader in high-performance, low-power system-level connectivity chips, today announced that the company’s TLSR9 Series SoC is now certified as a Thread 1.3.0 component, laying the groundwork for Matter device development. At the upcoming CES conference, Telink will be unveiling a new demo and end product samples of the Matter over Thread capabilities for TLSR9 SoC. “At Telink, we’re committed to delivering the best possible solutions to help developers utilize the latest technologies,” said Dr. Wenjun Sheng, CEO of Telink Semiconductor. “With the TLSR9 SoC officiall…